LeEco’s new high-end smartphone has just received a certification from the Chinese telecommunication agency TENAA in China. Like with every TENAA listing, some of the specs are confirmed and we have a first real look at the smartphone, which should be released by the end of 2016.
The phone features unibody metal design with very clean design. On the back is dual rear camera system with 13-megapixel sensors and dual-tone LED flash, a fingerprint scanner and LeEco’s logo. The front of the device has a 16-megapixel selfie camera and capacitative buttons. As for the hardware inside the phone, check the complete list of specs below.
LeEco Le X850 specifications
5.7-inch (2560 x 1440 pixels) Quad HD display
2.35GHz Quad-Core Snapdragon 821 64-bit processor with Adreno 530 GPU
4GB DDR4 RAM with 64GB internal memory
Android 6.0 (Marshmallow) with EUI 5.8
Dual SIM (nano + nano)
13MP dual rear cameras with dual-tone LED flash
16MP front-facing camera
Dimensions: 157.25×77.95×7.99mm; Weight: 185g
CDLA loss-less audio, Dolby Atmos, Ultrasonic fingerprint sensor, infrared sensor
4G VoLTE, WiFi 802.11ac (2.4/5 GHz MIMO), Bluetooth 4.2, GPS, USB Type C
3900mAh battery with Quick Charge 3.0